Sameer Sonkusale

Halligan 231A

(617) 627-5113

http://nanolab.ece.tufts.edu/

Education

  • B.E., Birla Institute of Technology and Science
  • M.S.E., University of Pennsylvania
  • Ph.D., University of Pennsylvania

Honors and Awards

  • Associate Editor, IEEE Transactions on Circuits and Systems
  • NSF CAREER Award, 2010
  • Best Poster, Future Trends in Microelectronics, 2009
  • Best Student Device Poster (Paper) Award, International Semiconductor Device Research Symposium, 2009
  • Best Poster (Paper) Award, 8th International Conference in Noanotechnology, 2008

Research

  • Integrated Circuits for Sensors and Instrumentation
  • Nanoelectrochemical Systems on Silicon
  • CMOS Image Sensors for Scientific Imaging
  • Analog to Information Converters
  • Active Metamaterial Circuits and Systems
  • Terahertz Integrated Circuits
  • Metamaterials and Plasmonics

Classes Taught

  • Advanced Analog Electronics
  • Electronics II
  • Analog and Mixed Signal MOS IC Design
  • Introduction to VLSI Design

Selected Publications

  • Liu, X., MacNaughton, S., Shrekenhamer, D. B., Tao, H., Selvarasah, S., Totachawattana, A., . . . Padilla, W. J. (2010). Metamaterials on parylene thin film substrates: Design, fabrication, and characterization at terahertz frequency. Applied Physics Letters, 96(1)
  • Luo, Z., & Sonkusale, S. (2008). A novel BPSK demodulator for biological implants. IEEE Transactions on Circuits and Systems I: Regular Papers, 55(6), 1478-1484.
  • Shrekenhamer, D., Rout, S., Strikwerda, A. C., Bingham, C., Averitt, R. D., Sonkusale, S., & Padilla, W. J. (2011). High speed terahertz modulation from metamaterials with embedded high electron mobility transistors. Optics Express, 19(10), 9968-9975.
  • Trakimas, M., & Sonkusale, S. R. (2011). An adaptive resolution asynchronous ADC architecture for data compression in energy constrained sensing applications. IEEE Transactions on Circuits and Systems I: Regular Papers,58(5), 921-934.
  • Xu, W., Luo, Z., & Sonkusale, S. (2009). Fully digital BPSK demodulator and multilevel LSK back telemetry for biomedical implant transceivers. IEEE Transactions on Circuits and Systems II: Express Briefs, 56(9), 714-718.